Molex’s Micro-Fit 3.0 delivers up to 8.5 A, 3.00 mm pitch power in a compact package in wire-to-wire and wire-to-board configurations. Power connectors are often required for oem in space-constrained applications. micro-Fit 3.0 blind mate interface (BMI) connectors are designed for blind mate applications. They allow mating mismatches. In hard-to-reach applications, such as drawers or fan assembly trays, connectors need to be mated and unmated without being seen. Doing so can damage the connector and/or terminals and consume valuable labour time.The Micro-Fit TPA connector series helps prevent end-product failures by providing Terminal Position Assurance (TPA).TPA reduces termination back-out by providing locking redundancy.The assembler cannot insert the TPA unless the terminals have been correctly inserted.

Micro-Fit 3.0 CPI (Pin Compatible) connectors provide a compatible pin interface while maintaining all the functionality of a standard Micro-Fit 3.0 connector. The robust pin eye design provides a reliable interface when following recommended board layouts.The Micro-Fit 3.0 CPI header mates with the Micro-Fit 3.0 receptacle to allow for run changes as the board moves from solder to press fit applications. To reduce application costs, oem often prefers compatible pin connectors that do not require soldering.

Micro-Fit 3.0 RMF (Reduced Mating Force) terminals are designed for applications that require lower contact and separation forces or when units are cycled frequently. The pre-lubricated version can be mated up to 250 times and fits into standard Micro-Fit 3.0 housings. Applications typically require robust terminations and low mating forces to reduce operator fatigue during assembly and/or to withstand high mating cycles.

Micro-Fit 3.0 is a unique interconnect system designed to meet the needs of high contact density signal or power connectors and integrates many of the features previously found on larger power connectors.Micro-Fit products are available in circuit sizes from 2 – 24 for single and double row, wire-to-board and wire-to-wire applications. The product line is available in over 500 part numbers with many retention options including mounting studs, solderable clips, and offset terminal retention. Low force lubricated terminations are designed for easy mating and un-mating.The Micro-Fit 3.0 connector system offers terminal position assurance, blind mating, and polarisation for accurate assembly.