OVERVIEW
The Molex MicroFit 3.0 connector family is known for its superior electrical performance, enabling high current transfer and low resistance connections in a compact design. This makes them ideal for use in harsh electrical environments, including consumer electronics, industrial automation, automotive electronics and datacom.

High Current Capability
MicroFit 3.0 connectors support current transfer of up to **8.5A** (depending on wire gauge and configuration). This performance is due to the following technical and design features:
– Optimized contact design: The use of premium conductive materials (e.g. highly conductive copper alloys) ensures stability under high current loads.
– Efficient current distribution: the double-row design and optional multi-pole configuration (2 to 24 ways) provide flexibility for higher power requirements.

Low Resistance Characteristics
MicroFit 3.0’s low-resistance design significantly reduces power loss at the connection point, resulting in improved energy efficiency:
– Improved contact surfaces: tin or gold plated options reduce oxidation and wear, maintaining low contact resistance over time.
– Precise mating force: Ensures contact reliability while reducing wear caused by the number of plugs and unplugs.
– Enhanced vibration resistance: Suitable for dynamic environments, effectively reducing resistance fluctuations that may result from loose contacts.

Adapts to Tough Electrical Environments
Molex MicroFit 3.0 is designed to meet a wide range of industry and environmental standards for high durability:
– Wide temperature range: Supports operating temperatures from -40°C to 105°C for extreme conditions.
– High Voltage Support: Rated up to 600V for high voltage equipment applications.
– Strong immunity to interference: Optimized design reduces the effects of electromagnetic interference (EMI) and radio frequency interference (RFI).

Summary
The Molex MicroFit 3.0 stands out for its superior performance in terms of high current and low resistance. Combined with a compact design and flexible configuration, it offers the ideal solution for reliable connectivity of modern, high-performance devices.