Dongguan Lanbo Electronics Technology Co., Ltd.

TE 0.059″ 1.5mm pitch 3P INVERTED SMT THRU BOARD 2106091-2 CONN HEADER SMD T/H 3POS 1.5MM
TE 0.059″ 1.5mm pitch 3P INVERTED SMT THRU BOARD 2106091-2 CONN HEADER SMD T/H 3POS 1.5MM
  • TE 0.059″ 1.5mm pitch 3P INVERTED SMT THRU BOARD 2106091-2 CONN HEADER SMD T/H 3POS 1.5MM

  • Part No : WF-2106091-2
    • 0.059″ 1.5mm pitch 3P INVERTED SMT THRU BOARD 2106091-2 CONN HEADER SMD T/H 4POS 1.5MM 
     
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Detailed description


wafers are mainly used in power systems, communication networks, financial manufacturing, elevators, industrial automation, medical equipment, office equipment, home appliances, military manufacturing, etc.

 

Contact:Catherine Tang

Email:sales01@dghoyato.com

Mobile/WhatsApp:+18692238587

 

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