Dongguan Lanbo Electronics Technology Co., Ltd.

Micro-Fit Header 3.0mm Wafer R/A Dip Type Double Row Micro Fit
Micro-Fit Header 3.0mm Wafer R/A Dip Type Double Row Micro Fit
  • Micro-Fit Header 3.0mm Wafer R/A Dip Type Double Row Micro Fit

  • Part No : WFDR30-XX
  • Specifications
    Current Rating: 5.0A AC/DC
    Voltage Rating: 250V AC/DC
    Contact Resistance: 10m ohm. Max
    Insulation Resistance: 1000Mohm min
    Withstanding Voltage: 1500V(r.m.s) For one Minute
    Operating Temperature Range: -40°C ~ +85°C
    Materials:
    Insulator: High Temp. Plastic(Nylon 66 UL94V-0)
    Color: Black
    Contact: Copper Alloy
    Plated: Tin Plated

     
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Detailed description


Micro Fit Jr. connectors offer compact and reliable electrical connections. Ideal for various applications, ensuring secure and efficient power distribution in confined spaces.

Wire to board realizes the space conversion and signal extension between PCB board and board by the extension of line to line. It is used in many fields such as automobile, communication, consumer electronics, data processing, industrial machinery and so on. Application in PCB connection and extension of Auxiliary Circ.

The Micro-Fit Connector family can withstand operating temperatures up to 125°C, is available in multiple circuit sizes and cable lengths for power applications and board-to-board, wire-to-board and wire-to-wire configurations.

Applications by Industry

Home Appliances: Freezers, Printers, Scanner, Security Systems, Washing machine

Automotive: Harness manufacturers, Inside devices, Non-sealed applications

MedTech: Diagnostic equipment, Patient Monitor

Telecommunications: Routers and switches, Servers, Storage

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