Dongguan Lanbo Electronics Technology Co., Ltd.

Micro-Fit Header 3.0mm Wafer R/A SMT Type With Metal Fork Molex Micro Fit
Micro-Fit Header 3.0mm Wafer R/A SMT Type With Metal Fork Molex Micro Fit
  • Micro-Fit Header 3.0mm Wafer R/A SMT Type With Metal Fork Molex Micro Fit

  • Part No : WFRASM30-XXT
  • Specifications
    Current Rating: 5.0A AC/DC
    Voltage Rating: 250V AC/DC
    Contact Resistance: 10m ohm. Max
    Insulation Resistance: 1000Mohm min
    Withstanding Voltage: 1500V(r.m.s) For one Minute
    Operating Temperature Range: -40°C ~ +85°C
    Materials:
    Insulator: High Temp. Plastic(Nylon 9T UL94V-0)
    Color: Black
    Contact: Copper Alloy
    Plated: Tin Plated

     
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Detailed description


Wire to board realizes the space conversion and signal extension between PCB board and board by the extension of line to line. It is used in many fields such as automobile, communication, consumer electronics, data processing, industrial machinery and so on. Application in PCB connection and extension of Auxiliary Circ.

The Micro-Fit Connector family can withstand operating temperatures up to 125°C, is available in multiple circuit sizes and cable lengths for power applications and board-to-board, wire-to-board and wire-to-wire configurations.

Applications by Industry

Home Appliances: Freezers, Printers, Scanner, Security Systems, Washing machine

Automotive: Harness manufacturers, Inside devices, Non-sealed applications

MedTech: Diagnostic equipment, Patient Monitor

Telecommunications: Routers and switches, Servers, Storage

 

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