Micro-Fit Header 3.0mm Wafer R/A Dip Type Molex Micro Fit
- Part No : WFRA30-XXT
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Specifications
Current Rating: 5.0A AC/DC
Voltage Rating: 250V AC/DC
Contact Resistance: 10m ohm. Max
Insulation Resistance: 1000Mohm min
Withstanding Voltage: 1500V(r.m.s) For one Minute
Operating Temperature Range: -40°C ~ +85°C
Materials:
Insulator: High Temp. Plastic(Nylon 9T UL94V-0)
Color: Black
Contact: Copper Alloy
Plated: Tin Plated - Inquiry now
- Products Drawing
Detailed description
Wire to board realizes the space conversion and signal extension between PCB board and board by the extension of line to line. It is used in many fields such as automobile, communication, consumer electronics, data processing, industrial machinery and so on. Application in PCB connection and extension of Auxiliary Circ.
Applications by Industry
Home Appliances: Freezers, Printers, Scanner, Security Systems, Washing machine
Automotive: Harness manufacturers, Inside devices, Non-sealed applications
MedTech: Diagnostic equipment, Patient Monitor
Telecommunications: Routers and switches, Servers, Storage
