Dongguan Lanbo Electronics Technology Co., Ltd.

2.5mm Wafer R/A Dip Type Molex
2.5mm Wafer R/A Dip Type Molex
  • 2.5mm Wafer R/A Dip Type Molex

  • Part No : WFRM25-XX
  • Specifications

    Current Rating: 3.0A AC/DC

    Voltage Rating: 250V AC/DC

    Contact Resistance: 20m ohm. Max

    Insulation Resistance: 1000Mohm min

    Withstanding Voltage: 500V(r.m.s) For one Minute

    Operating Temperature Range: -40°C ~ +105°C

    Materials:

    Insulator: High Temp. Plastic(Nylon 66 UL94V-0)

    Color: White

    Contact: Copper Alloy

    Plated: Tin Plated

     
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Detailed description


The Nano-Fit connector is a compact and versatile solution for connecting electronic devices. With its small size and high-performance capabilities, it provides seamless and reliable connectivity for various applications.

Wire to board realizes the space conversion and signal extension between PCB board and board by the extension of line to line. It is used in many fields such as automobile, communication, consumer electronics, data processing, industrial machinery and so on. Application in PCB connection and extension of Auxiliary Circ.

 

Nano-Fit Power Connectors deliver fully protected header terminals, a small pitch size color-coding/keying options that ensure proper mating and terminal position assurance (TPA) to reduce terminal back-out; available in Wire-to-Board and Wire-to-Wire configurations.

 

Applications by Industry

Home Appliances: Countertop, Dishwasher, Dryer, Microwave, Oven, Refrigerator, Washing machine

Automotive: Interior lighting and navigation

Industrial Automation: Assembly line equipment, Food and beverage, Industrial controls, Production lines

MedTech: Healthcare IT, Patient monitor

Telecommunications: Servers, Switches

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